TSMC to integrate CoWoS and SiPh in 2026, sources say


According to industry sources, TSMC is working to integrate CoWoS and SiPh, seeking to launch co-packaged optics (CPO) in 2026 that may inject fresh momentum ... Read more

Bron: DIGITIMES: IT news from Asia
Tags: TSMC
Geplaatst: 13 Dec 2024 - 02:18